Termopasta AKASA T5 Pro-klass+ heat sink compound Thermal paste 5.2 W/m·K 5 g

<b>Nano-Diamond Particles for Superior Heat Transmission</b>Use of hybrid silicone ja nano diamond micro particles ensures minimal thermal resistance for quick ja efficient heat transmission. Getting the most out of your processor, air ja liquid heatsink cooler. Making it perfect for overclockers.<b>Easy ja Safe Application</b>Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.<b>Conveniently Included Wipes ja Spreader</b>Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.<br />Akasa T5 Pro-Grade+. Type: Thermal paste, Thermal conductivity: 5.2 W/m·K, Product colour: Grey. Weight: 5 g. Quantity per pack: 1 pc(s)