Термопаста AKASA T5 Pro-класс+ heat sink compound Thermal paste 5.2 W/m·K 5 g

<b>Nano-Diamond Particles для Superior Heat Transmission</b>Use of hybrid silicone и nano diamond micro particles ensures minimal thermal resistance для quick и efficient heat transmission. Getting the most out of your processor, air и liquid heatsink cooler. Making it perfect для overclockers.<b>Easy и Safe Application</b>Non-curing paste means no time required to wait для curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.<b>Conveniently Included Wipes и Spreader</b>Easy application with included spreader to get an even coating on CPU or GPU для best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.<br />Akasa T5 Pro-Grade+. Type: Thermal paste, Thermal conductivity: 5.2 W/m·K, Product colour: Grey. Weight: 5 g. Quantity per pack: 1 pc(s)